A Glass Substrate for Semiconductors
A Glass Substrate Processing Technology
A Glass Substrates are Semiconductor Substrates made of Glass instead of Conventional Plastic. Applying glass substrates allow to reduce the thickness of semiconductor packages, reduce power consumption by half, and improve data throughput dramatically. JNTC has technologies such as cutting glass substrates used in semiconductor packaging, laser through-glass-vias (TGV) and electrode plating that can be used in glass packaging substrates
- Limitations of existing substrates due to the explosive increase in information channels due to the expansion of AI
- TGV is Smooth Surface, Low coefficient of Thermal Expansion, Low Thermal Conductivity, Flexible Strength, emerging as a game changer for semiconductor packaging
*Interposer: Auxiliary substrate acting as a mediator for complex circuits between chips and substrates
